Vertical and horizontal circuit assemblies

ABSTRACT

In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/279,336, filed on Feb. 19, 2019, which is a continuation of U.S.patent application Ser. No. 15/692,354, filed on Aug. 31, 2017, now U.S.Pat. No. 10,256,178, which claims priority to and the benefit of U.S.Provisional Application No. 62/383,753, filed Sep. 6, 2016, all entitled“VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES”, the disclosures of whichare hereby incorporated by reference in their entirety.

TECHNICAL FIELD

This description relates to circuit assemblies the can be mounted to aprinted circuit board. More specifically, this description relates tocircuit assemblies that can be vertically mounted (attached, affixed,etc.) to a printed circuit board (which can be referred to as verticalcircuit assemblies) and to circuit assemblies that can be eithervertically implemented or horizontally implemented.

SUMMARY

In a general aspect, an apparatus can include a leadframe including aplurality of leads and an assembly including a substrate and a pluralityof semiconductor die disposed on the substrate. The assembly can becoupled to the leadframe. The apparatus can also include a moldingcompound that at least partially encapsulates the leadframe and theassembly, an inductor having a first terminal and a second terminal. Thefirst terminal of the inductor can be electrically coupled with a firstcontact pad of the leadframe. The first contact pad can be exposedthrough the molding compound by a mold cavity defined in the moldingcompound. At least a portion of the first terminal can be disposed inthe mold cavity. The second terminal of the inductor can be electricallycoupled with a second contact pad of the leadframe. The leadframe, theassembly and the inductor can be arranged in a stacked configuration.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1F are diagrams illustrating a vertical circuit assembly andcomponents of that circuit assembly, according to an implementation.

FIGS. 2A-2F are diagrams illustrating another vertical circuit assemblyand components of that circuit assembly, according to an implementation.

FIGS. 3A-3E are diagrams illustrating another vertical circuit assemblyand components of that circuit assembly, according to an implementation.

FIGS. 4A-4F are diagrams illustrating another vertical circuit assemblyand components of that circuit assembly, according to an implementation.

FIGS. 5A-5D are diagrams illustrating another vertical circuit assemblyand components of that circuit assembly, according to an implementation.

FIGS. 6A-6C are diagrams illustrating another vertical circuit assemblyand components of that circuit assembly, according to an implementation.

FIGS. 7A-7F are diagrams illustrating another vertical circuit assemblyand components of that circuit assembly, according to an implementation.

FIGS. 8A-8F are diagrams illustrating another vertical circuit assemblyand components of that circuit assembly, according to an implementation.

FIGS. 9A and 9B are diagrams illustrating a circuit assembly, accordingto an implementation.

DETAILED DESCRIPTION

This disclosure, in part, relates to implementations of circuitassemblies (e.g., illustrated in FIGS. 1A-8E) that are configured bevertically mounted (attached, affixed, etc.) to a printed circuit board(PCB). Accordingly, for purposes of this disclosure, such circuitassemblies may be referred to as vertical circuit assemblies. Suchvertical circuit assemblies can include a leadframe that has both bent(e.g., curved) power and signal pins, suitable for surface mounting(attaching, soldering, etc.) to a PCB, and straight power and signalpins, suitable for through-hole mounting (affixing, soldering, etc.) ona PCB. In other implementations, other power and signal pin arrangementsare possible, such using all straight, through-hole mounted pins. Thisdisclosure also relates to circuit assemblies, such as theimplementation shown in FIGS. 9A and 9B that can be used in a horizontalimplementation, or in a vertical implementation.

The approaches illustrated and described herein can be used to produceany number of different circuit assemblies for mounting to a PCB.However, for purposes of illustration and clarity, the embodimentsillustrated and described herein will be discussed with respect to powerconverter (e.g., buck-converter) vertical circuit assemblies. Such buckconverters can include a high-side field effect transistor (FET), alow-side FET, a control circuit, passive components (e.g., capacitorsand resistors) and an output inductor, which, using the implementationsdescribed herein, can be integrated in a vertical circuit assembly thatcan be vertically mounted on a PCB. Such a vertical power convertercircuit assembly can be implemented in a number of different devices,such as a server computer, a personal computer, a laptop computer, anetbook computer, and so forth.

In the implementations described herein, the high-side FET, the low-sideFET and the control circuit can be implemented using one or moreintegrated circuits (ICs) or semiconductor devices (e.g., semiconductorchips). For instance, each of the high-side FET, the low-side FET andthe control circuit can be implemented in a respective IC orsemiconductor chip. In other implementations, the FETs can beimplemented together in a single IC and the control circuit implementedin a second IC. In still other implementations all three of thehigh-side FET, the low-side FET and the control circuit can bemonolithically implemented in a single IC or semiconductor chip.

Using vertical circuit assemblies, such as those disclosed herein, toimplement such power converters can reduce a footprint area (e.g., anarea of an associated PCB that is consumed/used when mounting a powerconverter circuit assembly) for adding power phases to increase peakpower levels in an associated device or system, such as those indicatedabove. For instance, current power converter circuit assemblies havefootprints on the order of 700-1225 mm². Using vertical circuitassemblies, such as those described herein, to implement functionallyequivalent (substantially functionally equivalent) power converters canresult in a (vertical) circuit assembly with a PCB footprint (area usedfor the power converter) on the order of 360 mm², which is a reductionin footprint (PCB area used) of approximately 50-70%.

Generally, the vertical circuit assemblies described herein, andillustrated in the drawings can include, in various combinations, aleadframe (e.g., a copper leadframe, etc.); a multi-chip (e.g., multiplesemiconductor-device) assembly (which can include the high-side FET, thelow-side FET and the control circuit of a corresponding power converterstage); an output inductor, a molding compound and one or more passivecomponents (e.g., capacitors and/or resistors), where the leadframe,multi-chip assembly and the output inductor are arranged in a stackedconfiguration, such as the configurations described herein.

In such implementations, a multi-chip assembly of a given verticalcircuit assembly can include a substrate (e.g., a ceramic substrate withprinted signal lines and contact pads for mounting/solder components ofthe power converter) and/or a multi-chip package. Depending on theimplementation, the high-side FET, the low-side FET and the controlcircuit can be included in a multi-chip package that is mounted on asubstrate. Alternatively, the high-side FET, the low-side FET and thecontrol circuit can be mounted (soldered, etc.) directly on a (ceramic)substrate (e.g., flip-chip mounted). Also, depending on theimplementation, passive components of a power converter in such avertical circuit assembly can be mounted on a substrate, included in amulti-chip package and/or mounted on a leadframe (e.g., between signalpins/leads of the leadframe). Further, depending on the implementation,an integrated output inductor can be solder mounted in the verticalcircuit assembly or can be slide inserted in the vertical circuitassembly (e.g., frictionally held in place and in electrical contact inthe vertical circuit assembly). Still further, in some implementations,contact areas configured for attachment of terminals of the outputinductor can be sized so as to allow for different size inductors (e.g.,with different pitches between inductor terminals).

For the implementations described herein, similar elements arereferenced with like reference numbers of a respective sequence ofreference numbers for each for a given implementation. For example, forthe implementation illustrated in FIGS. 1A-1F, a leadframe is referencewith reference number 110, while for the implementation illustrated inFIGS. 2A-2F, a leadframe is referenced with reference number 210, andfor the implementation illustrated in FIGS. 3A-3E, a leadframe isreferenced with reference number 310, and so forth. Similar numbering isused for other similar elements in the various drawings of thedisclosure.

FIGS. 1A-1F are diagrams illustrating an embodiment of a verticalcircuit assembly (assembly) 100 (and components of the assembly 100)that can be used to implement a power converter circuit. In otherimplementations, the assembly 100 (or a similar vertical circuitassembly) can be used to implement circuits other than a power convertercircuit. The assembly 100 of FIGS. 1A-1F includes a leadframe 110, asubstrate 120 (e.g., a printed ceramic substrate), an output inductor130 and a molding compound 140, where the various views of FIGS. 1A-1Fshow the relationship of the various elements of the assembly 100 to oneanother. The assembly 100 can be referred to as fully-overmolded (e.g.,injection molded, compression molded, etc.), as the entire assembly 100,with the exception of the power and signal pins of the leadframe 110that are used to mount the assembly 100 to a PCB and an exposed surfaceof the substrate 120, is enclosed in the molding compound 140.

FIG. 1A is a plan, design layout view of the assembly 100, FIG. 1B is across-sectional view of the assembly 100 along the section line A-A inFIG. 1A and FIG. 1C is a cross-sectional view of the assembly 100 alongthe section line B-B in FIG. 1A. The view of the assembly 100 shown inFIG. 1A can be referred to as an x-ray, plan view, as outlines of eachelement (component) of the assembly 100 are shown in FIG. 1A, so as toshow their arrangement with respect to each other.

As shown in FIGS. 1A-1C, the substrate 120 can be flip mounted on theleadframe 110 (e.g., where solder connections on an upper surface of thesubstrate, such as shown in FIG. 1F, are coupled with, or soldered tothe leadframe 110). In this implementation, a high-side FET, a low-sideFET, a control circuit IC, and one or more passive devices can beaffixed (soldered, etc.) to the substrate 120 prior to attaching thesubstrate 120 to the leadframe 110. Passive devices may also be directlyaffixed (soldered, etc.) to the leadframe 110. Alternatively, thehigh-side FET, the low-side FET, the control circuit IC, and the one ormore passive devices could be attached to the substrate 120 using a samesolder reflow process that is used to attach the substrate 120 to theleadframe 110. After overmolding the assembly 100, the molding compound140 can be ground to expose the substrate 120, such as a backside of thesubstrate 120 as shown in FIGS. 1A and 1B (e.g., for heat-dissipationpurposes during operation of the assembly 100). In some implementations,a heat slug or heatsink can also be affixed to the exposed substrate 120to improve heat dissipation (e.g. reduce thermal resistance).

As shown in FIGS. 1A and 1B, 1D and 1E, the leadframe 110 can include aplurality of straight power and signal leads (pins) and a plurality ofbent power and signal leads (pins) that are disposed along a single side(edge, etc.) of the assembly 100, which allows the assembly 100 to bevertically mounted on a PCB. As discussed above, the straight leads canbe through-hole mounted in an associated PCB, while the bent leads canbe surface mounted on the PCB. Straight leads can be, for example, leadsthat extend linearly away from the molding compound 140 without anycurves or bends. Bent leads, for example, can have a first portion thatextends linearly away from the molding compound 140 and a second portion(e.g., at distal end of the first portion) that is orthogonal to(substantially orthogonal to) the first portion, where the secondportion can contact the PCB for surface mounting to signal traces on thePCB.

As shown in FIGS. 1A and 1C, the inductor 130 can include terminals 135that are affixed (soldered, attached, contacted, etc.) to the leadframe110. As noted above, in the assembly 100, the inductor 130 can be whollyenclosed (disposed) within the molding compound 140. FIG. 1D illustratesa top side view of the assembly 100, where the substrate 120 is exposedthrough the molding compound 140 (e.g., after grinding the moldingcompound 140). FIG. 1E shows a bottom side view of the fully overmoldedassembly 100. FIG. 1F illustrates the substrate 120 with printed signaltraces for operatively (e.g., electrically) coupling various componentsof the power converter of the assembly 100 with one another, and theleadframe 100 (and the inductor 130), such as a high-side FET, alow-side FET, a control circuit IC, and one or more passive devices.

FIGS. 2A-2F are diagrams illustrating an embodiment of a verticalcircuit assembly (assembly) 200 (and components of the assembly 200)that can be used to implement a power converter circuit. In otherimplementations, the assembly 200 (or a similar vertical circuitassembly) can be used to implement circuits other than a power convertercircuit. The assembly 200 of FIGS. 2A-2F includes a leadframe 210, asubstrate 220 (e.g., a printed ceramic substrate), an output inductor230 and a molding compound 240, where the various views of FIGS. 2A-2Fshow the relationship of the various elements of the assembly 200 to oneanother. The assembly 200 can be referred to as beingpartially-overmolded (e.g., injection molded, compression molded, etc.),as only the leadframe 210 and the substrate 220 (expect for the exposedsurfaces of the leadframe 210 and the substrate 220 discussed below) areenclosed in the molding compound 240.

FIG. 2A is a plan, design (x-ray) layout view of the assembly 200, FIG.2B is a cross-sectional view of the assembly 200 along the section lineA-A in FIG. 2A and FIG. 2C is a cross-sectional view of the assembly 200along the section line B-B in FIG. 2A.

As shown in FIGS. 2A-2C, the substrate 220 can be flip mounted on theleadframe 210. In this implementation, as with the assembly 100, ahigh-side FET, a low-side FET, a control circuit IC, and one or morepassive devices can be affixed (soldered, etc.) to the substrate 220prior to attaching the substrate 220 to the leadframe 210. Passivedevices may also be directly affixed (soldered, etc.) to the leadframe210. Alternatively, the high-side FET, the low-side FET, the controlcircuit IC, and the one or more passive devices could be attached to thesubstrate 220 using a same solder reflow process that is used to attachthe substrate 220 to the leadframe 210. After overmolding the leadframe210 and the substrate 220, the molding compound 240 can be ground toexpose the substrate 220, such as a backside of the substrate 220 asshown in FIGS. 2A and 2B (e.g., for heat-dissipation purposes duringoperation of the assembly 200). In some implementations, a heat slug canalso be affixed to the exposed substrate 220 to improve heat dissipation(e.g. reduce thermal resistance).

As shown in FIGS. 2A and 2B and 2D-2F, the leadframe 210 can include aplurality of straight power and signal leads (pins) and a plurality ofbent power and signal leads (pins) that are disposed along a single side(edge, etc.) of the assembly 200, which allows the assembly 200 to bevertically mounted on a PCB. As discussed above, the straight leads canbe through-hole mounted in an associated PCB, while the bent leads canbe surface mounted on the PCB.

As shown in FIGS. 2A, 2B and 2G, the inductor 230 can include terminals235 that are affixed (soldered, attached, contacted, etc.) to theleadframe 210 at contact pads 215. As shown in FIG. 2C, the moldingcompound 240 can include at least one mold cavity 245 that are formedduring molding of the leadframe 210 and the substrate 220. As shown inFIG. 2E, the contact pads 215 (for coupling the inductor terminals 235with the leadframe 210) can be exposed through the mold cavities 245. Asnoted above, in the assembly 200, the inductor 230 is not enclosed inthe molding compound 240, and can be installed in the assembly 200 aftermolding and grinding the molding compound 240 to expose the substrate220.

FIG. 2D illustrates a top side view of the assembly 200, where thesubstrate 220 is exposed through the molding compound 240 (e.g., aftergrinding the molding compound 240). FIG. 2E shows a bottom side view ofthe molded leadframe 210 and substrate 220, with the contact pads 215(for the inductor terminals 235) exposed through the mold cavity 245 inthe molding compound 240. FIG. 2F illustrates a bottom side view of theassembly 200 after attaching (soldering, affixing, etc.) the terminals235 of the inductor 230 with the contact pads 215.

FIGS. 3A-3E are diagrams illustrating an embodiment of a verticalcircuit assembly (assembly) 300 (and components of the assembly 300)that can be used to implement a power converter circuit. In otherimplementations, the assembly 300 (or a similar vertical circuitassembly) can be used to implement circuits other than a power convertercircuit. The assembly 300 of FIGS. 3A-3E includes a leadframe 310 (withcopper pedestals 315 attached for inductor terminal contact surfaces), asubstrate 320 (e.g., a printed ceramic substrate), an output inductor330 and a molding compound 340, where the various views of FIGS. 3A-3Eshow the relationship of the various elements of the assembly 300 to oneanother. As with the assembly 200, the assembly 300 can be referred toas being partially-overmolded (e.g., injection molded, compressionmolded, etc.), as only the leadframe 310, the substrate 320 and copperpedestals 315 (expect for the exposed surfaces of the pedestals 315 andthe substrate 320 discussed below) are enclosed in the molding compound340.

FIG. 3A is a plan, design (x-ray) layout view of the assembly 300, FIG.3B is a cross-sectional view of the assembly 300 along the section lineA-A in FIG. 3A and FIG. 3C is a cross-sectional view of the assembly 300along the section line B-B in FIG. 3A.

As shown in FIGS. 3A-3C, the substrate 320 can be flip mounted on theleadframe 310. In this implementation, as with the assemblies 100 and200, a high-side FET, a low-side FET, a control circuit IC, and one ormore passive devices can be affixed (soldered, etc.) to the substrate320 prior to attaching the substrate 320 to the leadframe 310. Passivedevices may also be directly affixed (soldered, etc.) to the leadframe310. Alternatively, the high-side FET, the low-side FET, the controlcircuit IC, and the one or more passive devices could be attached to thesubstrate 320 using a same solder reflow process that is used to attachthe substrate 320 to the leadframe 310. After overmolding the leadframe310, the copper pedestals 315 and the substrate 320, the moldingcompound 340 can be ground to expose the substrate 320, such as abackside of the substrate 320 (e.g., for heat-dissipation purposesduring operation of the assembly 300), such as shown in FIGS. 3A and 3B.In some implementations, a heat slug can also be affixed to the exposedsubstrate 320 to improve heat dissipation (e.g. reduce thermalresistance). For the assembly 300, the molding compound 340 can also beground to expose to expose contact surfaces of the copper pedestals 315for contacting the terminals 335 of the inductor 330.

As shown in FIGS. 3A and 3B, 3D and 3E, the leadframe 310 can include aplurality of straight power and signal leads (pins) and a plurality ofbent power and signal leads (pins) that are disposed along a single side(edge, etc.) of the assembly 300, which allows the assembly 300 to bevertically mounted on a PCB. As discussed above, the straight leads canbe through-hole mounted in an associated PCB, while the bent leads canbe surface mounted on the PCB.

As shown in FIGS. 3A, 3B and 3E, the inductor 330 can include terminals335 that are affixed (soldered, attached, contacted, etc.) to theleadframe 310 through the copper pedestals 315. As shown in FIG. 3C, thecopper pedestals 315 can be exposed through the molding compound 340,e.g., by grinding the molding compound 340, as discussed above. Incertain implementations, the copper pedestals 315 can be sized so as toaccommodate inductors 330 of various sizes (e.g., with different pitchesbetween the inductor terminals 335). As noted above, in the assembly300, the inductor 330 is not enclosed in the molding compound 340, andcan be installed in the assembly 300 after molding and grinding toexpose the substrate 220 and the copper pedestals 215.

As is also shown in FIG. 3C, the copper pedestals 315 may have a contactsurface area (contact area, footprint, etc.) on the leadframe 310 (or,alternatively, on a substrate, such as the substrate 320, for example)that is smaller than a contact surface area (contact area, footprint,etc.) of the copper pedestals 315 that is exposed through the moldingcompound (e.g., for mounting the terminals 335 of the inductor 330)after grinding the molding compound 340. Using such an approach allowsfor attaching components (such as the inductor 330) with differentterminal sizes and different terminal pitches (e.g., distance betweenterminals) to the exposed surface of the cooper pedestals 315, whilehaving smaller contact surfaces on the leadframe 310 or the substrate320, thus providing a larger exposed contact area than a contact areaused to connect to the leadframe 310 or, depending on theimplementation, to the substrate 320.

FIG. 3D illustrates a top side view of the assembly 300, where thesubstrate 320 is exposed through the molding compound 340 (e.g., aftergrinding the molding compound 340). FIG. 3E illustrates a bottom sideview of the assembly 300 after attaching (soldering, affixing, etc.) theterminals 335 of the inductor 330 with the copper pedestals 315.

FIGS. 4A-4F are diagrams illustrating an embodiment of a verticalcircuit assembly (assembly) 400 (and components of the assembly 400)that can be used to implement a power converter circuit. In otherimplementations, the assembly 400 (or a similar vertical circuitassembly) can be used to implement circuits other than a power convertercircuit. The assembly 400 of FIGS. 4A-4F includes a leadframe 410, asubstrate 420 (e.g., a printed ceramic substrate), an output inductor430 and a molding compound 440, where the various views of FIGS. 4A-4Fshow the relationship of the various elements of the assembly 400 to oneanother. As with the assemblies 200 and 300, the assembly 400 can bereferred to as being partially-overmolded (e.g., injection molded,compression molded, etc.), as only the leadframe 410 and the substrate420 (expect for the exposed surfaces of the leadframe 410 and thesubstrate 420 discussed below) are enclosed in the molding compound 440.

FIG. 4A is a plan, design (x-ray) layout view of the assembly 400, FIG.4B is a cross-sectional view of the assembly 400 along the section lineA-A in FIG. 4A and FIG. 4C is a cross-sectional view of the assembly 400along the section line B-B in FIG. 4A.

As shown in FIGS. 4A-4C, the substrate 420 can be flip mounted on theleadframe 410. In this implementation, as with the assemblies 100, 200and 300, a high-side FET, a low-side FET, a control circuit IC, and oneor more passive devices can be affixed (soldered, etc.) to the substrate420 prior to attaching the substrate 420 to the leadframe 410. Passivedevices may also be directly affixed (soldered, etc.) to the leadframe410. Alternatively, the high-side FET, the low-side FET, the controlcircuit IC, and the one or more passive devices could be attached to thesubstrate 420 using a same solder reflow process that is used to attachthe substrate 420 to the leadframe 410. After overmolding the leadframe410 and the substrate 420, the molding compound 440 can be ground toexpose the substrate 420, such as a backside of the substrate 420 asshown in FIGS. 4A, 4B, 4E and 4F (e.g., for heat-dissipation purposesduring operation of the assembly 400). In some implementations, a heatslug can also be affixed to the exposed substrate 420 to improve heatdissipation (e.g. reduce thermal resistance).

As shown in FIGS. 4A and 4B and 4D-4F, the leadframe 410 can include aplurality of straight power and signal leads (pins) 412 and a pluralityof bent power and signal leads (pins) 414 that are disposed along asingle side (edge, etc.) of the assembly 400, which allows the assembly400 to be vertically mounted on a PCB. As discussed above, the straightleads 412 can be through-hole mounted in an associated PCB, while thebent leads 414 can be surface mounted on the PCB.

As shown in FIGS. 4A, 4C and 4F, the inductor 430 can include a coilportion 432 and terminals 435 that are affixed (attached, contacted,etc.) to the leadframe 410 at contact pads 415. In the assembly 400, theinductor 440 can be slide inserted or tight fit and its terminals 435can be frictionally held in place against the contact pads 415 (such asa result of mechanical pressure between the terminals 435 and thecontact pads 415 due to contact of the molding compound 440 with thecoil portion 432 of the inductor 430 on an opposite side of the assembly400). Additionally, contact pads 415 and terminals 435 can also bewelded by (laser beam, etc.) to firmly connect them. As shown in FIG.4C, the molding compound 440 can include mold cavity 445 that are formedduring molding of the leadframe 410 and the substrate 420. As shown inFIG. 4E, the contact pads 415 (for coupling the inductor terminals 435with the leadframe 410) can be exposed through the mold cavity 445. Asnoted above, in the assembly 400, the inductor 430 is not enclosed inthe molding compound 440, and can be installed (slide inserted) in theassembly 400 after molding and grinding the molding compound 440 toexpose the substrate 420.

FIG. 4D illustrates a bottom side view of the assembly 400 beforeinsertion of the inductor 430. FIG. 4E illustrates a top side view ofthe assembly 400 before insertion of the inductor 430, where the contactpads 415 and the substrate 420 are exposed through the molding compound440 (e.g., after grinding the molding compound 440 to expose thesubstrate 420). FIG. 4F illustrates a top side view of the assembly 400after attaching (slide inserting) the inductor 430 such that theinductor terminals 435 are in contact with the contact pads 415.

FIGS. 5A-5D are diagrams illustrating an embodiment of a verticalcircuit assembly (assembly) 500 that can be used to implement a powerconverter circuit. In other implementations, the assembly 500 (or asimilar vertical circuit assembly) can be used to implement circuitsother than a power converter circuit. The assembly 500 of FIGS. 5A-5Dincludes a leadframe 510, a multi-chip module (multi-chip semiconductordevice package) 520, an output inductor 530, a molding compound 540 andone or more passive devices 550, where the various views of FIGS. 5A-5Dshow the relationship of the various elements of the assembly 500 to oneanother. As with the assemblies 200, 300 and 400, the assembly 500 canbe referred to as being partially-overmolded (e.g., injection molded,compression molded, etc.), as only the leadframe 510, the multi-chipmodule (MCM) 520 and the passive devices 550 (expect for the exposedsurfaces of the leadframe 510 and the MCM 520 discussed below) areenclosed in the molding compound 540.

FIG. 5A is a plan, design (x-ray) layout view of the assembly 500, FIG.5B is a cross-sectional view of the assembly 500 along the section lineA-A in FIG. 5A, FIG. 5C is a cross-sectional view of the assembly 500along the section line B-B in FIG. 5A and FIG. 5D is a cross-sectionalview of the assembly 500 along the section line C-C in FIG. 5A. It isnoted that the section lines in FIG. 5A for the assembly 500 are notstraight section lines in order to show details of more features of theassembly 500 in the respective cross-sectional views of FIGS. 5B-5D thanwould be shown using straight section lines.

As shown in FIGS. 5A-5D, the MCM 520 can be mounted on the leadframe510. In this implementation, a high-side FET, a low-side FET and acontrol circuit IC of a power converter can be included in the MCM 520.Further, in the assembly 500, one or more passive devices 500 (e.g.,capacitors and/or resistors) can be affixed (soldered, etc.) directly tothe leadframe 510 (e.g., as shown in FIGS. 5A, 5B and 5D) prior to, orafter attaching the MCM 520 to the leadframe 510. Alternatively, the MCM520, and the one or more passive devices 550, can be attached to theleadframe 510 using a same solder reflow process.

As shown in FIG. 5A-5C, the leadframe 510 can include a plurality ofstraight power and signal leads (pins) and a plurality of bent power andsignal leads (pins) that are disposed along a single side (edge, etc.)of the assembly 500, which allows the assembly 500 to be verticallymounted on a PCB. As discussed above, the straight leads can bethrough-hole mounted in an associated PCB, while the bent leads can besurface mounted on the PCB.

As shown in FIGS. 5A, 5B and 5D, the inductor 530 can include terminals535 that are affixed (soldered, attached, contacted, etc.) to theleadframe 510 (in similar fashion as with the contact pads 215 of theassembly 200). As shown in FIG. 5D, the molding compound 540 can includeat least one mold cavity 545 (two are shown in, e.g., FIGS. 5A and 5D)that are formed during molding of the leadframe 510, the MCM 520 and thepassive devices 550 with the molding compound 540. A portion of theleadframe 510 (for coupling the inductor terminals 535 to the leadframe510) can be exposed through the mold cavities 545. As noted above, inthe assembly 500, the inductor 530 is not enclosed in the moldingcompound 540, and can be installed in the assembly 500 after molding.

FIGS. 6A-6C are diagrams illustrating an embodiment of a verticalcircuit assembly (assembly) 600 that can be used to implement a powerconverter circuit. In other implementations, the assembly 600 (or asimilar vertical circuit assembly) can be used to implement circuitsother than a power converter circuit. The assembly 600 of FIGS. 6A-6Cincludes a leadframe 610, with copper clips (which can be referred to asC-clips due to their cross-sectional “C” shape, but are not limited to a“C” shape) 615 attached to the leadframe 610 for providing inductorterminal contact surfaces, a MCM 620 (e.g., including a high-side FET, alow-side FET and a control circuit IC), an output inductor 630, amolding compound 640 and one or more passive devices 650 (or othercomponents), where the various views of FIGS. 6A-6C show therelationship of the various elements of the assembly 600 to one another.As with the assemblies 200, 300, 400 and 500, the assembly 600 can bereferred to as being partially-overmolded (e.g., injection molded,compression molded, etc.), as only the leadframe 610, the MCM 620, theC-clips 615 and the passive devices 650 (expect for the exposed surfacesof the C-clips 615 and the MCM 620 discussed below) are enclosed in themolding compound 640.

FIG. 6A is a plan, design (x-ray) layout view of the assembly 600, FIG.6B is a cross-sectional view of the assembly 600 along the section lineA-A in FIG. 6A and FIG. 6C is a cross-sectional view of the assembly 600along the section line B-B in FIG. 6A. As with FIG. 5A of the assembly500, it is noted that the section lines in FIG. 6A for the assembly 600are not straight section lines, in order to show details of morefeatures of the assembly 600 in the respective cross-sectional views ofFIGS. 6B-6C than would be illustrated using straight section lines.

As shown in FIGS. 6A-6C, the MCM 620 can be mounted on the leadframe610. Further, in the assembly 600, the one or more passive devices 650(e.g., capacitors and/or resistors) can be affixed (soldered, etc.)directly to the leadframe 610 (e.g., as shown in FIGS. 5A and 5B) prioror after attaching the MCM 620 to the leadframe 610. Alternatively, theMCM 620 and the one or more passive devices 650 can be attached to theleadframe 610 using a same solder reflow process.

After overmolding the leadframe 610, the C-clips 615, the MCM 620 andthe passive devices 650, the molding compound 640 can be ground toexpose the contact pads 616 of the C-clips 615 for coupling terminals635 of the inductor 630 with the leadframe 610.

As shown in FIGS. 6A and 6B, the leadframe 610 can include a pluralityof straight power and signal leads (pins) 612 and a plurality of bentpower and signal leads (pins) 614 that are disposed along a single side(edge, etc.) of the assembly 600, which allows the assembly 600 to bevertically mounted on a PCB. As discussed above, the straight leads 612can be through-hole mounted in an associated PCB, while the bent leads614 can be surface mounted on the PCB.

As shown in FIGS. 6A and 6C, the inductor 630 can include terminals 635that are affixed (soldered, attached, contacted, etc.) to the leadframe610 through the C-clips 615. As shown in FIG. 6C, the C-clips 615 can beexposed through the molding compound 640, e.g., by grinding the moldingcompound 640, as discussed above. In certain implementations, theC-clips 615 can be sized so as to accommodate inductors 630 of varioussizes (e.g., with different pitches between the inductor terminals 635).As noted above, in the assembly 600, the inductor 630 is not enclosed inthe molding compound 640, and can be installed in the assembly 600 aftermolding and grinding to expose the C-clips 615.

FIGS. 7A-7F are diagrams illustrating an embodiment of a verticalcircuit assembly (assembly) 700 that can be used to implement a powerconverter circuit. In other implementations, the assembly 700 (or asimilar vertical circuit assembly) can be used to implement circuitsother than a power converter circuit. The assembly 700 of FIGS. 7A-7Fincludes a pre-molded leadframe 760, which includes a leadframe 710 anda molding compound 740. As shown in FIG. 7E, power and signal leads(pins) of the leadframe 710 can be exposed through the molding compound740, so as to provide contact surfaces. The assembly 700 also includes asubstrate 720 that has an MCM 720 a mounted thereon, an output inductor730 and one or more passive devices 750 mounted on the substrate 750.The various views of FIGS. 7A-7F show the relationship of the variouselements of the assembly 700 to one another.

In the assembly 700, the substrate 720 (with the MCM 720 a and thepassives 750) can be affixed (attached, mounted, soldered) to thepre-molded leadframe 760. For instance, contact pads printed on thesubstrate 720 (as shown in FIG. 7D) can be affixed to correspondingcontact surfaces of the leadframe 710 exposed through the moldingcompound 740 (as shown in FIG. 7E). Also in the assembly 700, incontrast with assemblies 100-600 and 800, terminals 735 of the inductor730 can be affixed (attached, mounted, soldered) to the substrate 720,rather than to the leadframe, pedestals or C-clips.

As shown in FIGS. 7A, 7B, 7E and 7F, the leadframe 710 can include aplurality of straight power and signal leads (pins) and a plurality ofbent power and signal leads (pins) that are disposed along a single side(edge, etc.) of the assembly 700, which allows the assembly 700 to bevertically mounted on a PCB. As discussed above, the straight leads canbe through-hole mounted in an associated PCB, while the bent leads canbe surface mounted on the PCB.

FIG. 7D illustrates top side and back side views of the substrate 720with the MCM 720 a and passive devices 750 mounted thereon. FIG. 7Eshows a top side view of the pre-molded leadframe 760, which includesthe leadframe 710 and the molding compound 740. FIG. 7F shows the x-rayplan view of the assembly 700 of FIG. 7A and a side view of the assembly700 with sample dimensions given in millimeters. It will be appreciatedthat the implementations of the other drawings (FIGS. 1A-6C and 8A-8E)can have similar dimensions.

FIGS. 8A-8E are diagrams illustrating an embodiment of a verticalcircuit assembly (assembly) 800 that can be used to implement a powerconverter circuit. In other implementations, the assembly 800 (or asimilar vertical circuit assembly) can be used to implement circuitsother than a power converter circuit. The assembly 800 of FIGS. 8A-8Eincludes a leadframe 810 (with copper pedestals 815 attached forinductor terminal contact surfaces), a MCM 820 (e.g., such as the MCMs520 and 620), an output inductor 830, a molding compound 840, one ormore passive devices 850 and a heat slug 870, where the various views ofFIGS. 8A-8E show the relationship of the various elements of theassembly 800 to one another. As with the assemblies 200, 300, 400, 500and 600, the assembly 800 can be referred to as beingpartially-overmolded (e.g., injection molded, compression molded, etc.),as only the leadframe 810, the pedestals 815 and the MCM 820 (except forthe exposed surfaces of the pedestals 815 and the MCM 820 discussedbelow) are enclosed in the molding compound 840.

FIG. 8A is a plan, design (x-ray) layout view of the assembly 800, FIG.8B is a cross-sectional view of the assembly 800 along the section lineA-A in FIG. 8A, FIG. 8C is a cross-sectional view of the assembly 800along the section line B-B in FIG. 8A and FIG. 8D is a cross-sectionalview of the assembly 800 along the section line C-C in FIG. 8A. As withFIGS. 5A and 6A of the respective assemblies 500 and 600, it is notedthat the section lines in FIG. 8A for the assembly 800 are not straightsection lines, in order to show details of more features of the assembly800 in the respective cross-sectional views of FIGS. 8B-8D than would beillustrated using straight section lines.

As shown in FIGS. 8A and 8C-8E, the MCM 820 can be mounted on theleadframe 810. Further, in the assembly 800, the one or more passivedevices 850 (e.g., capacitors and/or resistors) can be affixed(soldered, etc.) directly to the leadframe 810 (e.g., as shown in FIGS.8A and 8D) prior to attaching the MCM 820 to the leadframe 810.Alternatively, the MCM 820 and the one or more passive devices 850 canbe attached to the leadframe 810 using a same solder reflow process.

After overmolding the leadframe 810, the pedestals 815, the MCM 820 andthe passive devices 850, the molding compound 840 can be ground toexpose the contact pads of the pedestals 815 for coupling terminals 835of the inductor 830 with the leadframe 810. The molding compound 840 canalso be ground to expose the MCM 820, which can have a heat slug 870affixed therewith. Such an implementation can allow for efficientthermal dissipation from both the top side and bottom side of theassembly 800 (e.g., cooling on two sides of the assembly 800).

As shown in FIGS. 8A-8C and 8E, the leadframe 810 can include aplurality of straight power and signal leads (pins) and a plurality ofbent power and signal leads (pins). As discussed above, the straightleads can be through-hole mounted in an associated PCB, while the bentleads can be surface mounted on the PCB.

As shown in FIGS. 8A, 8B and 8E, the inductor 830 can include terminals835 that are affixed (soldered, attached, contacted, etc.) to theleadframe 810 through the pedestals 815. As shown in FIGS. 8B and 8D,the pedestals 815 can be exposed through the molding compound 840, e.g.,by grinding the molding compound 840, as discussed above. In certainimplementations, the pedestals 815 can be sized so as to accommodateinductors 830 of various sizes (e.g., with different pitches between theinductor terminals 835). As noted above, in the assembly 800, theinductor 830 is not enclosed in the molding compound 840, and can beinstalled in the assembly 800 after molding and grinding to expose thepedestals 815.

As is also shown in FIG. 8D (similar to the implementation shown in FIG.3C), the copper pedestals 815 may have a contact surface area (contactarea, footprint, etc.) on the leadframe 810 (or, alternatively, on asubstrate, such as ceramic substrate or on the MCM 820, for example)that is smaller than a contact surface area (contact area, footprint,etc.) of the copper pedestals 815 that is exposed through the moldingcompound 840 (e.g., for mounting the terminals 835 of the inductor 830)after grinding the molding compound 840. Using such an approach allowsfor attaching components (such as the inductor 830) with differentterminal sizes and different terminal pitches (e.g., distance betweenterminals) to the exposed surface of the cooper pedestals 815, whilehaving smaller contact surfaces on the leadframe 810 or the substrate820, thus providing a larger exposed contact area than a contact areaused to connect to the leadframe 810 or, depending on theimplementation, to the substrate 820.

FIG. 8E shows the x-ray plan view of the assembly 800 of FIG. 8A and aside view of the assembly 800 with sample dimensions given inmillimeters. It will be appreciated that the implementations of theother drawings (FIGS. 1A-7F and 9A-9B) can have similar dimensions.

FIGS. 9A-9B are diagrams illustrating an embodiment of a circuitassembly (assembly) 900, which can be implemented as a horizontalcircuit assembly or, alternatively, as a vertical circuit assembly, suchas by including a leadframe with power and signal pins as shown in theembodiments illustrated in FIGS. 1A-8E. The circuit assembly 900 can beused to implement a power converter circuit assembly or other circuitassembly. As shown in FIGS. 9A and 9B, the assembly 900 includes analternative embodiment of a C-clip 915 from the C-clip 615 shown inFIGS. 6A-6C.

As shown in FIG. 9A, the C-clip 915 can include a half-etched region 917on an underside of an upper portion of the C-clip 915. The half-etchedregion 917 can be defined using one or more photolithography and/or etchprocesses, where a portion of the material (e.g., copper) of the C-clip915 is removed to define the half-etched region 917. The C-clip 915 canthen be attached (affixed, soldered, adhered, etc.) to a substrate 920(e.g., a ceramic, printed circuit substrate or other substrate). As alsoshown in FIG. 9A (and FIG. 9B), a number of other components 950 (e.g.,passive components, and so forth) can be disposed on the substrate 920,and can be disposed below (vertically below) the upper surface of theC-clip 915. Such an approach can allow for an overall size of thesubstrate 920 to be reduced, as the components 950 are attached to thesubstrate under the C-clip 915, rather than being laterally disposedoutside a perimeter of the C-clip 915, which would require a largersubstrate 920 than shown in FIGS. 9A and 9B.

After affixing (attaching, soldering, etc.) the C-clip 915 and thecomponents 950 to the substrate 920, the C-clip and the components 940can be overmolded with a molding compound 940. In the assembly 900 ofFIG. 9A, the line 919 illustrates a (desired) grind depth (backgrinddepth), which corresponds with the depth of the half-etched portion 917.As shown in FIG. 9B, after grinding the overmolded assembly 900 to thedepth shown by line 919 in FIG. 9A, the C-clip 915 is separated into twoseparate conductors 915 a and 915 b, which are structurally supported bythe molding compound 940. Using such an approach, a single C-clip 915can be used to produce two separate electrical connections to theovermolded substrate 920 using the surfaces of the conductors 915 a and915 b that are exposed through the molding compound 940. Similarly tothe C-clip 615 and the inductor 630 shown in FIG. 6A-6C, a component,such as an inductor, or multiple components can be mounted, soldered,affixed, attached, etc. to the surfaces of the conductors 915 a and 915b (of the C-clip 915) that are exposed through the molding compound 940.

In a first example, an apparatus can include a leadframe including aplurality of leads configured to be coupled with a printed circuitboard. The plurality of leads can be disposed along a single edge of theapparatus. The apparatus can also include an assembly including asubstrate and a plurality of semiconductor die disposed on thesubstrate. The assembly can be mounted on the leadframe. The apparatuscan further include an inductor having a first terminal and a secondterminal. The first terminal of the inductor can being coupled with theleadframe via a first contact pad, and the second terminal of theinductor can be coupled with the leadframe via a second contact pad. Theleadframe, the assembly and the inductor can be arranged in a stackedconfiguration.

In a second example based on the first example, the substrate caninclude one of a ceramic substrate or a multi-chip package.

In a third example based on any one of the first and second examples,the apparatus can include a molding compound, the leadframe beingdisposed in the molding compound.

In a fourth example based on the third example, the assembly can bedisposed in the molding compound.

In a fifth example based on any one of the third and fourth examples,the output inductor can be disposed in the molding compound.

In a sixth example based on any one of the third through fifth examples,a surface of the substrate of the assembly can be exposed through themolding compound.

In a seventh example based on any one of the third through sixthexamples, the first contact pad and the second contact pad can beincluded in the leadframe, and respective surfaces of the first contactpad and the second contact pad can be exposed through the moldingcompound.

In an eighth example based on any one of the first through seventhexamples, the apparatus can include at least one passive device coupledwith the leadframe.

In an ninth example based on any one of first through eighth examples,the plurality of leads can include at least one straight lead and atleast one bent lead, the at least one straight lead being configured tobe coupled with a through-hole of the printed circuit board and the atleast one bent lead being configured to be mounted on a surface of theprinted circuit board.

In a tenth example based on any one of the first through sixth, theeighth and the ninth examples, the first contact pad and the secondcontact pad can include, respectively, a first copper pedestal coupledwith the leadframe and a second copper pedestal coupled with theleadframe.

In an eleventh example based on any one of the first through sixth, theeighth and the ninth examples, the first contact pad and the secondcontact pad can include, respectively, a first copper clip coupled withthe leadframe and a second copper clip coupled with the leadframe.

In a twelfth example based on any one of the first through eleventhexamples, the first terminal of the output inductor and the secondterminal of the output inductor can be soldered, respectively, to thefirst contact pad and the second contact pad.

In a thirteenth example based on any one of the first through fourth orsixth through twelfth examples, the first terminal of the outputinductor and the second terminal of the output inductor can befrictionally held in contact with, respectively, the first contact padand the second contact pad.

In a fourteenth example based on any one of the first through thirteenthexamples, the assembly can be mounted on a first side of the leadframe;and the first terminal of the output inductor, and the second terminalof the output inductor can be coupled with a second side of theleadframe, the second side being opposite the first side.

In a fifteenth example based on any one of the first through thirteenthexamples, the first terminal of the output inductor and the secondterminal of the output inductor can be coupled with as same side of theleadframe on which the assembly is mounted.

In a sixteenth example, an apparatus can include a leadframe including aplurality of leads configured to be coupled with a printed circuitboard, the plurality of leads being disposed along a single edge of theapparatus; an assembly including a substrate and a plurality ofsemiconductor die disposed on the substrate, the assembly being mountedon the leadframe; and an inductor having a first terminal and a secondterminal. The first terminal of the inductor can be coupled with theleadframe via a first contact pad, and the second terminal of theinductor can be coupled with the leadframe via a second contact pad. Theleadframe can be disposed between the assembly and the inductor.

In a seventeenth example based on the sixteenth example, the apparatuscan include a molding compound, at least one of the leadframe, theassembly and/or the output inductor being disposed in the moldingcompound.

In an eighteenth example based on any one of the sixteenth andseventeenth examples, the plurality of leads can include at least onestraight lead and at least one bent lead. The at least one straight leadcan be configured to be coupled with a through-hole of the printedcircuit board, and the at least one bent lead can be configured to bemounted on a surface of the printed circuit board.

In a nineteenth example based on any one of the sixteenth througheighteenth examples, the first contact pad and the second contact padcan include, respectively, a first copper pedestal coupled with theleadframe and a second copper pedestal coupled with the leadframe.

In a twentieth example based on any one of the sixteenth througheighteenth examples, the first contact pad and the second contact padcan include, respectively, a first copper clip coupled with theleadframe and a second copper clip coupled with the leadframe.

It will be understood that, in the foregoing description, when anelement, such as a layer, a region, or a substrate, is referred to asbeing on, connected to, electrically connected to, coupled to, orelectrically coupled to another element, it may be directly on,connected or coupled to the other element, or one or more interveningelements may be present. In contrast, when an element is referred to asbeing directly on, directly connected to or directly coupled to anotherelement or layer, there are no intervening elements or layers present.Although the terms directly on, directly connected to, or directlycoupled to may not be used throughout the detailed description, elementsthat are shown as being directly on, directly connected or directlycoupled can be referred to as such. The claims of the application may beamended to recite exemplary relationships described in the specificationor shown in the figures.

As used in this specification, a singular form may, unless definitelyindicating a particular case in terms of the context, include a pluralform. Spatially relative terms (e.g., over, above, upper, under,beneath, below, lower, top, bottom, and so forth) are intended toencompass different orientations of the device in use or operation inaddition to the orientation depicted in the figures. In someimplementations, the relative terms above and below can, respectively,include vertically above and vertically below. In some implementations,the term adjacent can include laterally adjacent to or horizontallyadjacent to.

Some implementations may be implemented using various semiconductorprocessing and/or packaging techniques. Some implementations may beimplemented using various types of semiconductor processing techniquesassociated with semiconductor substrates including, but not limited to,for example, silicon (Si), silicon carbide (SiC), gallium arsenide(GaAs), gallium nitride (GaN), and/or so forth.

While certain features of the described implementations have beenillustrated as described herein, many modifications, substitutions,changes and equivalents will now occur to those skilled in the art. Itis, therefore, to be understood that the appended claims are intended tocover all such modifications and changes as fall within the scope of theimplementations. It should be understood that they have been presentedby way of example only, not limitation, and various changes in form anddetails may be made. Any portion of the apparatus and/or methodsdescribed herein may be combined in any combination, except mutuallyexclusive combinations. The implementations described herein can includevarious combinations and/or sub-combinations of the functions,components and/or features of the different implementations described.

What is claimed is:
 1. An apparatus comprising: a leadframe including aplurality of leads; an assembly including a substrate and a plurality ofsemiconductor die disposed on the substrate, the assembly being coupledto the leadframe; a molding compound that at least partiallyencapsulates the leadframe and the assembly; and an inductor having afirst terminal and a second terminal, the first terminal of the inductorbeing electrically coupled with a first contact pad of the leadframe,the first contact pad being exposed through a mold cavity defined in themolding compound, at least a portion of the first terminal beingdisposed in the mold cavity, the second terminal of the inductor beingelectrically coupled with a second contact pad of the leadframe, and theleadframe, the assembly and the inductor being arranged in a stackedconfiguration.
 2. The apparatus of claim 1, wherein: the mold cavity isa first mold cavity; the second contact pad is exposed through a secondmold cavity defined in the molding compound; and at least a portion ofthe second terminal is disposed in the mold cavity.
 3. The apparatus ofclaim 1, wherein the substrate includes a ceramic substrate.
 4. Theapparatus of claim 1, wherein the assembly include a multi-chip module.5. The apparatus of claim 1, wherein a surface of the substrate isexposed through the molding compound.
 6. The apparatus of claim 5,wherein the mold cavity is disposed on a first side of the apparatus,and the surface of the substrate exposed through the molding compound isdisposed on a second side of the apparatus that is opposite the firstside.
 7. The apparatus of claim 1, further comprising at least onepassive device coupled to the leadframe.
 8. The apparatus of claim 1,wherein the plurality of leads of the leadframe includes at least onestraight lead and at least one bent lead, the at least one straight leadbeing configured to be coupled with a through-hole of a printed circuitboard and the at least one bent lead being configured to be mounted on asurface of the printed circuit board.
 9. The apparatus of claim 1,wherein the first terminal of the inductor and the second terminal ofthe inductor are soldered, respectively, to the first contact pad andthe second contact pad.
 10. The apparatus of claim 1, wherein the firstterminal of the inductor and the second terminal of the inductor arecoupled with a same side of the leadframe to which the assembly iscoupled.
 11. The apparatus of claim 1, wherein the first terminal of theinductor and the second terminal of the inductor are coupled with anopposite side of the leadframe to which the assembly is coupled.
 12. Theapparatus of claim 1, wherein the plurality of leads of the leadframeare disposed along a single edge of the apparatus.
 13. The apparatus ofclaim 1, wherein the inductor includes a coil that is disposed outsidethe molding compound.
 14. An apparatus comprising: a leadframe includinga plurality of leads; an assembly including a substrate and a pluralityof semiconductor die disposed on the substrate, the assembly beingcoupled to the leadframe; a molding compound that at least partiallyencapsulates the leadframe and the assembly; and an inductor having afirst terminal and a second terminal, the first terminal of the inductorbeing electrically coupled with a first contact pad of the leadframe,the first contact pad being exposed through a first mold cavity definedin the molding compound, at least a portion of the first terminal beingdisposed in the first mold cavity, the second terminal of the inductorbeing electrically coupled with a second contact pad of the leadframe,the second contact pad being exposed through a second mold cavitydefined in the molding compound, at least a portion of the secondterminal being disposed in the second mold cavity, and the assembly andthe inductor each being disposed on a same side of the leadframe. 15.The apparatus of claim 14, wherein a surface of the assembly is exposedthrough the molding compound.
 16. The apparatus of claim 14, furthercomprising at least one passive device coupled with the leadframe. 17.The apparatus of claim 14, wherein the substrate includes a ceramicsubstrate.
 18. An apparatus comprising: a leadframe including aplurality of leads; an assembly including a substrate and a plurality ofsemiconductor die disposed on the substrate, the assembly being coupledto the leadframe; a molding compound that at least partiallyencapsulates the leadframe and the assembly; and an inductor having afirst terminal and a second terminal, the first terminal of the inductorbeing electrically coupled with a first contact pad of the leadframe,the first contact pad being exposed through a first mold cavity definedin the molding compound, at least a portion of the first terminal beingdisposed in the first mold cavity, the second terminal of the inductorbeing electrically coupled with a second contact pad of the leadframe,the second contact pad being exposed through a second mold cavitydefined in the molding compound, at least a portion of the secondterminal being disposed in the second mold cavity, and the assembly andthe inductor each being disposed on opposite sides of the leadframe. 19.The apparatus of claim 18, wherein a surface of the assembly is exposedthrough the molding compound.
 20. The apparatus of claim 18, wherein thesubstrate includes a ceramic substrate.